Optimization of PI & PBO Layers Lithography Process for High Density Fan-Out Wafer Level Packaging & Next Generation Heterogeneous Integration Applications Employing Digitally Driven Maskless Lithography

Abstract

The updated roadmap for advanced packaging shows an increased need for denser next-generation heterogeneous integration designs. With the goal of further reducing the currently achieved via diameters in critical dielectric layers tailored for FOWLP, we evaluated high performing polyimide (PI) and polybenzoxazole (PBO) materials using a maskless exposure lithography system that enables instant design changes.