Corrosion and Corrosion Protection of Copper Sculptures by Formation of Composite Barrier

Rajesh Kumar Singh, K. Hema
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Abstract

Nitrogen dioxide, carbon dioxide and sulphur dioxide are acidic gas and they produce corrosive medium for copper sculptures. These gases absorb moisture to form nitric acid, carbonic and sulphuric acid. It forms corrosion cell on the surface of copper and accelerate corrosion reactions. The corrosion cell formation is written as: Cu|Cu2+||H+|H2 thus corrosion reactions start and copper is oxidized into Cu2+surface and it is oxidized into Cu2+ whereas H+ ion is reduced into H2 . Nitric acid environment copper exhibits galvanic, pitting, stress, crevice, blistering, embrittlement and intergranular corrosion. The corrosion reactions change physical, chemical and mechanical properties of corroded materials. Nanocoating compound tetrahydrodibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC electrospray compounds used to control the corrosion of copper in nitrogen dioxide medium. For corrosion mitigation of copper metal interface was coated with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. The coating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone was synthesized in laboratory. Nozzle spray techniques used for nanocoating and electrospraying. The corrosion rate of copper was determined by gravimetric loss method at different temperatures, concentrations and days in nitrogen dioxide medium. Potentiostatic polarization technique used for the determination of electrode potential, corrosion current and current density. Nanocoating and electrospraying compounds formed a composite barrier on the surface of base metal by chemical bonding. The nanocoating and electrospray compounds adhered on base metal by chemisorptions to confirm by activation energy, heat of adsorption, free energy, enthalpy and entropy. The nanocoating and electrospray deposited on copper confirmed by Langmuir, Frundlich and Temkin isotherm. Copper formed a complex compound to interact with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. Electrospraying SiC blocked porosities of nanocoating compound and checked osmosis process of nitrogen dioxide. Thenanocoating and electrospray compounds decreased corrosion rate and increased surface coverage areas and percentage coating efficiencies.
复合屏障形成对铜雕塑腐蚀及防腐的影响
二氧化氮、二氧化碳和二氧化硫是酸性气体,它们对铜雕塑产生腐蚀性介质。这些气体吸收水分形成硝酸、碳酸和硫酸。它在铜表面形成腐蚀细胞,加速腐蚀反应。腐蚀细胞形成为:Cu|Cu2+||H+|H2,腐蚀反应开始,铜被氧化成Cu2+表面,被氧化成Cu2+, H+离子被还原成H2。硝酸环境下铜表现出电偶、点蚀、应力、缝隙、起泡、脆化和晶间腐蚀。腐蚀反应改变了被腐蚀材料的物理、化学和机械性能。纳米涂层化合物四氢二苯并[a,d][7]环烯-5,11-二氨基脲和碳化硅电喷涂化合物用于控制铜在二氧化氮介质中的腐蚀。在铜金属界面涂覆四氢二苯并[a,d][7]环烯-5,11-二氨基脲和SiC以减缓铜金属界面的腐蚀。在实验室合成了包衣化合物四氢二苯并[a,d][7]环烯-5,11-二氨基脲。用于纳米涂层和电喷涂的喷嘴喷涂技术。用重量损失法测定了铜在不同温度、浓度和时间的二氧化氮介质中的腐蚀速率。恒电位极化技术用于测定电极电位、腐蚀电流和电流密度。纳米涂层和电喷涂化合物通过化学键合在母材表面形成复合屏障。通过化学吸附将纳米涂层和电喷雾化合物粘附在母材上,并通过活化能、吸附热、自由能、焓和熵进行验证。通过Langmuir, Frundlich和Temkin等温线证实了纳米涂层和电喷雾沉积在铜表面。铜与四氢二苯并[a,d][7]环烯-5,11-二氨基脲和SiC形成配合物相互作用。电喷涂SiC可以阻断纳米涂层的孔隙,抑制二氧化氮的渗透过程。纳米涂层和电喷涂化合物降低了腐蚀速率,增加了表面覆盖面积和涂层效率百分比。
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