An experiment research on transient liquid phase diffusion bonding

Abstract

This paper experiments transient-liquid-phase (TLP) diffusion bonding to weld oxygen-free copper to oxygen-free copper in high-frequency parts. Our experiment results indicate that TLP bonding using an Au interlayer performs better than solid diffusion welding. In our TLP bonding, the welding temperature is set around the one near the formation of transient liquid phase. The diffusion-width increases with holding time. Our TLP bonding can also be used in Cu-Au diffusion bonding directly.