A framework for reliability modeling of electronics

Abstract

A physics-of-failure approach and the associated CADMP (computer aided design of microelectronic packages) software assist cost effective MCM (multichip module) designs scientific consideration of reliability during the design phase; evaluation of new materials, structures, and technologies; assessment of packages designed by different manufacturers; development of science-based tests, screens, and derating methods. The tools can also be used to assess reliability, of single chip package designs, including plastic encapsulated microcircuits (PEMs). The development and validation process for CADMP software continues. At present, the software is being exercised by over forty government and industry organizations, and feedback is being used to ready the software for commercialization.<>