Wavelets modeling of inductance of interconnect in digital circuits of mixed-signal ICs

Abstract

The effective inductance modeling of interconnects in mixed-signal ICs using the wavelets is exhaustively analyzed and four steps construction algorithm of sparse inductance matrix is derived which fits simulated results well. To extract the numerical value of sparse inductance matrix effectively, a function of interpolating wavelet basis is introduced in the construction algorithm to compress the original dense matrix. Moreover, the increasing importance of inductive effect of interconnects is discussed and fundamental limitations for substrate noise on mixed-signal ICs caused by inductance coupling are pointed out. The numerical results show that the proposed model and its extraction algorithm have many advantages of run time and memory space, which make the flexible and fast simulation in the initial stage of design possible. It is also shown that the consideration of on-chip inductance and its accurate extraction help to characterize the substrate noise in frequency domain.