High-speed system bus for a SoC network processing platform

J.P. Bissou, M. Dubois, Y. Savaria, G. Bois
{"title":"High-speed system bus for a SoC network processing platform","authors":"J.P. Bissou, M. Dubois, Y. Savaria, G. Bois","doi":"10.1109/ICM.2003.238564","DOIUrl":null,"url":null,"abstract":"Interconnecting modules in a SoC platform requires modules compatibility. Several solutions are available, but they either lack the necessary throughput or the flexibility. This paper proposes an interconnection architecture for a flexible on-chip high-performance communication medium that can provide variable bandwidth. It is based on the AHB AMBA bus. The proposed architecture has been implemented in the Seamless environment and laid out using a 0.18 /spl mu/m CMOS with Cadence tools to validate the proposed concept.","PeriodicalId":180690,"journal":{"name":"Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICM.2003.238564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Interconnecting modules in a SoC platform requires modules compatibility. Several solutions are available, but they either lack the necessary throughput or the flexibility. This paper proposes an interconnection architecture for a flexible on-chip high-performance communication medium that can provide variable bandwidth. It is based on the AHB AMBA bus. The proposed architecture has been implemented in the Seamless environment and laid out using a 0.18 /spl mu/m CMOS with Cadence tools to validate the proposed concept.
用于SoC网络处理平台的高速系统总线
SoC平台中模块的互连需要模块兼容性。有几种解决方案可用,但它们要么缺乏必要的吞吐量,要么缺乏灵活性。提出了一种可提供可变带宽的柔性片上高性能通信介质的互连体系结构。它基于AHB AMBA总线。所提出的架构已经在Seamless环境中实现,并使用带有Cadence工具的0.18 /spl mu/m CMOS进行布局,以验证所提出的概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信