Three-Dimensional Metallic Electromagnetic Bandgap Structure for a Selective Shielding at the Microwave Band: Design and Simulation

2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) Pub Date : 2021-11-01 DOI:10.1109/comcas52219.2021.9629023

H. Noronha, L. Kretly

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Abstract

Nowadays, innovative and disruptive new technologies, e.g., 5G, electric vehicles, and others, have given rise to increasingly challenging environment for electromagnetic interference (EMI) suppression, therefore, to overcome this issue new innovative solutions to provide electromagnetic shielding are needed. This paper aims to investigate, numerically, the design of a three-dimensional metallic electromagnetic bandgap (EBG) structure that employ an inverse woodpile cell in order to perform a highly effective shielding for frequencies up to 10 GHz, as well as to allow communication frequencies, selectively mitigating EMI in the electronic device from the external environment, and vice-versa. Our results have shown that the structure presents strong peaks of reflections in the region where frequency is below the cutoff frequency characterizing the 3-D EBG, furthermore, this structure may provide component-level shielding due to complete bandgap and may be well-tuned for vehicular EMC applications that must meet international standards.

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用于微波波段选择性屏蔽的三维金属电磁带隙结构:设计与仿真

如今，创新和颠覆性的新技术，如5G、电动汽车等，给电磁干扰(EMI)抑制带来了越来越具有挑战性的环境，因此，为了克服这一问题，需要新的创新解决方案来提供电磁屏蔽。本文旨在从数值上研究三维金属电磁带隙(EBG)结构的设计，该结构采用逆木桩单元，以便对高达10 GHz的频率执行高效屏蔽，以及允许通信频率，选择性地减轻来自外部环境的电子设备中的EMI，反之亦然。我们的研究结果表明，该结构在频率低于表征3-D EBG的截止频率的区域呈现出强烈的反射峰，此外，由于完全带隙，该结构可以提供组件级屏蔽，并且可以很好地调谐到必须符合国际标准的车载EMC应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)

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