{"title":"Poled plasma polymers to produce stable on chip modulators for chip to chip optical interconnect","authors":"R. Kubacki","doi":"10.1109/LEOSST.2004.1338698","DOIUrl":null,"url":null,"abstract":"We have presented the architecture of a silicon nanocomposite photonic interconnect structure based on using an off chip broad band light source and precision tuned microring resonators for demultiplexing. Non linear optical polymers have been developed with high electro optic coefficients and demonstrated operationally at well over 100 GHz. These materials are formed by the \"poling\" of the polymer to produce the required alignment. Further, they possess the ability to integrate with CMOS processing to capitalize on the ability of silicon based microelectronics to produce low cost, optically interconnected CMOS microelectronic devices.","PeriodicalId":280347,"journal":{"name":"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOSST.2004.1338698","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We have presented the architecture of a silicon nanocomposite photonic interconnect structure based on using an off chip broad band light source and precision tuned microring resonators for demultiplexing. Non linear optical polymers have been developed with high electro optic coefficients and demonstrated operationally at well over 100 GHz. These materials are formed by the "poling" of the polymer to produce the required alignment. Further, they possess the ability to integrate with CMOS processing to capitalize on the ability of silicon based microelectronics to produce low cost, optically interconnected CMOS microelectronic devices.