Teng Li, Karina Schneider, Alexander Haag, A. Visweswaran, Akanksha Bhutani, T. Zwick
{"title":"Design of Wideband Dielectric Resonator Antenna for D-Band Applications","authors":"Teng Li, Karina Schneider, Alexander Haag, A. Visweswaran, Akanksha Bhutani, T. Zwick","doi":"10.23919/ISAP47258.2021.9614546","DOIUrl":null,"url":null,"abstract":"In this paper, a wideband dielectric resonator antenna (DRA) is proposed for the D-band antenna-in-package (AiP) solution. A low-cost AiP solution based on the high density interconnect (HDI) printed circuit board (PCB) process is proposed for the first time for D-band applications. The radio-frequency (RF) chip is embedded in the multi-layer PCBs and packaged with flip-chip bonding. The RF signal is transferred from the chip to the top of the package by a vertical transition for antenna excitation. As an example, the DRA (0.5 mm Alumina cube) is designed with a single-ended microstrip-fed on the package top. The measured impedance matching bandwidth is 115-162 GHz with a peak gain of 5.5 dBi at 154 GHz.","PeriodicalId":132941,"journal":{"name":"2021 International Symposium on Antennas and Propagation (ISAP)","volume":"122 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 International Symposium on Antennas and Propagation (ISAP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ISAP47258.2021.9614546","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In this paper, a wideband dielectric resonator antenna (DRA) is proposed for the D-band antenna-in-package (AiP) solution. A low-cost AiP solution based on the high density interconnect (HDI) printed circuit board (PCB) process is proposed for the first time for D-band applications. The radio-frequency (RF) chip is embedded in the multi-layer PCBs and packaged with flip-chip bonding. The RF signal is transferred from the chip to the top of the package by a vertical transition for antenna excitation. As an example, the DRA (0.5 mm Alumina cube) is designed with a single-ended microstrip-fed on the package top. The measured impedance matching bandwidth is 115-162 GHz with a peak gain of 5.5 dBi at 154 GHz.