{"title":"Preliminary Design of Reentrant Square Cavity for EIK Application","authors":"Che Xu, C. Paoloni, L. Meng","doi":"10.1109/ucmmt53364.2021.9569918","DOIUrl":null,"url":null,"abstract":"A slow-wave structure (SWS) with periodic coupling structure and reentrant cavity is proposed for extending the extended interaction klystron (EIK) technology. The conventional higher-order mode single-period cavities allow for larger sizes, corresponding to the G-band (220 GHz), but their low R/Q values are not facilitating the realization of extended interaction klystron (EIK). The newly proposed compact EIK topology is to support millimeter-wave higher-order mode operations. The slow wave structure facilitates the advantages of multi-layered processing.","PeriodicalId":117712,"journal":{"name":"2021 14th UK-Europe-China Workshop on Millimetre-Waves and Terahertz Technologies (UCMMT)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 14th UK-Europe-China Workshop on Millimetre-Waves and Terahertz Technologies (UCMMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ucmmt53364.2021.9569918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A slow-wave structure (SWS) with periodic coupling structure and reentrant cavity is proposed for extending the extended interaction klystron (EIK) technology. The conventional higher-order mode single-period cavities allow for larger sizes, corresponding to the G-band (220 GHz), but their low R/Q values are not facilitating the realization of extended interaction klystron (EIK). The newly proposed compact EIK topology is to support millimeter-wave higher-order mode operations. The slow wave structure facilitates the advantages of multi-layered processing.