Thin ZnO layer for RRAM Applications

S. Kaushik, R. Singhal, D. Avasthi, Ramcharan
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引用次数: 2

Abstract

Resistive Random-Access Memory (RRAM) is considered for next generation non-volatile memory application. RRAM has fascinated researchers due to its simple structure, lower switching voltages, high density, fast switching speeds and feasible integration into CMOS processing. Transition-Metal-Oxides have been shown to be brilliant materials for RRAM applications. Among them ZnO is one the most promising materials owing to its being fab-friendly feature, having dielectric constant (k=10). A thin film of ZnO was deposited on ITO coated glass substrate by RF sputtering using radio frequency of 13.5 Mhz and Ar as carrier gas where the substrate to target distance is 7cm and Substrate rotation is 10 rpm. The RF power is 100W. The deposition rate is 0.2-0.3 A°/S. Thickness of the ZnO film was determined to be 100 nm by Rutherford backscattering using 2 MeV alpha particles from Pelletron accelerator. The I-V characteristics of the above sample was performed by using probe station (two probe mode) with pressure contact made of W metal using Keithley 6517b electrometer at IUAC, Delhi. The I-V characteristics showed a hysteresis behaviour.
用于RRAM应用的薄ZnO层
电阻式随机存取存储器(RRAM)被认为是下一代非易失性存储器的应用。RRAM因其结构简单、开关电压低、密度高、开关速度快以及可集成到CMOS工艺中而受到研究人员的青睐。过渡金属氧化物已被证明是RRAM应用的优秀材料。其中,ZnO的介电常数(k=10)为晶圆厂友好型,是最有前途的材料之一。在基材与靶材距离为7cm,基材旋转速度为10rpm的条件下,采用射频频率为13.5 Mhz, Ar为载气的方法,在ITO涂层玻璃基材上溅射制备了ZnO薄膜。射频功率为100W。沉积速率为0.2 ~ 0.3 A°/S。利用来自Pelletron加速器的2 MeV α粒子进行卢瑟福后向散射,确定ZnO薄膜的厚度为100 nm。上述样品的I-V特性是在德里IUAC的Keithley 6517b静电计上用W金属压力接触的探针站(双探针模式)进行的。I-V特性表现出迟滞特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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