A UV-curable solder mask for flexible printed circuitry — From evaluation to manufacturing

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI:10.1109/EIC.1977.7461923

Gerald B. Fefferman

引用次数: 0

Abstract

This paper traces the history of a program to procure, evaluate, modify and utilize ultraviolet radiation (UV) curable resins for solder mask coating of flexible printed circuitry. The development of a particular system is described. Test procedures and acceptability criteria are discussed.

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柔性印刷电路用紫外光固化阻焊膜。从评估到制造

本文回顾了柔性印刷电路阻焊涂层用紫外线固化树脂的制备、评价、改性和利用的历史。描述了一个特定系统的开发。讨论了测试程序和可接受性标准。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

1977 EIC 13th Electrical/Electronics Insulation Conference

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