'Hibridas' photoimageable thick film process and materials for microwave and sensor component applications

Abstract

The 'Hibridas' photoimageable thick film process was originally developed by the Microelectronics department of the Research Institute for Radiomeasurement Engineering (now Hibridas Enterprise Ltd.) during the early 1980s. Using this process, it is possible to achieve thick film conductor line and space resolutions of 20 /spl mu/m/30 /spl mu/m at a fired film thickness of 10 /spl mu/m on a standard alumina substrate. The Hibridas process equipment is described, and the performance of microwave devices and sensor components produced with Hibridas thick film materials are reported. The results show that photoimageable thick film technology may be of great interest to designers and producers of thick film circuits and components for applications where extremely fine line geometries and resolutions are required.