Simulation Study on Current Collapse Effect of E GaN HEMT

G. Weiling, Ma Qijing, D. Shuai, Lin Tianyu, Zhu Yanxu
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Abstract

GaN high electron mobility transistor(GaN HEMT) has high channel electron concentration, high electron mobility and high breakdown voltage, which makes it have great development prospects in high frequency, microwave and other fields. In the development of GaN HEMT, suppressing current collapse has always been the focus and difficulty of research. Based on SILVACO TCAD simulation software, the current collapse suppression by field plate structure is studied and discussed in this paper. Firstly, the model of enhanced GaN HEMT device is established and its correctness is verified. Then, the phenomenon of current collapse and virtual gate model are introduced. From the theory of improving breakdown voltage of device by field plate structure as the starting point, field plate structure is added to the device model and simulation experiments are carried out. According to the results, the principle of suppression current collapse by field plate structure is analyzed, and the correctness of virtual grid model is verified.
氮化镓HEMT电流坍缩效应的仿真研究
GaN高电子迁移率晶体管(GaN HEMT)具有高通道电子浓度、高电子迁移率和高击穿电压等特点,在高频、微波等领域具有很大的发展前景。在GaN HEMT的发展过程中,抑制电流崩溃一直是研究的重点和难点。本文基于SILVACO TCAD仿真软件,对场板结构对电流塌陷的抑制进行了研究和讨论。首先,建立了增强型GaN HEMT器件模型,并验证了模型的正确性。然后介绍了电流崩溃现象和虚门模型。从利用场极板结构提高器件击穿电压的理论出发,在器件模型中加入场极板结构,并进行了仿真实验。根据研究结果,分析了场板结构抑制电流崩溃的原理,验证了虚拟网格模型的正确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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