{"title":"Complete analysis of the complex and arbitrary bilateral finlines","authors":"Humberto Fernandes, J. De Albuquerque Sales Neto","doi":"10.1109/ITS.1998.718428","DOIUrl":null,"url":null,"abstract":"An electromagnetic application is developed to obtain the effective dielectric constant, the attenuation constant and the characteristic impedance of the arbitrary bilateral fin lines with semiconductor substrate and conductor thickness simultaneity for the first time. Also the concise transverse transmission line (TTL) full wave method is used in the analysis. New results of the complex propagation and of the characteristic impedance as functions of the frequency and different dimensions and conductivity of the substrate, are obtained in 3D.","PeriodicalId":205350,"journal":{"name":"ITS'98 Proceedings. SBT/IEEE International Telecommunications Symposium (Cat. No.98EX202)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-08-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITS'98 Proceedings. SBT/IEEE International Telecommunications Symposium (Cat. No.98EX202)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITS.1998.718428","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An electromagnetic application is developed to obtain the effective dielectric constant, the attenuation constant and the characteristic impedance of the arbitrary bilateral fin lines with semiconductor substrate and conductor thickness simultaneity for the first time. Also the concise transverse transmission line (TTL) full wave method is used in the analysis. New results of the complex propagation and of the characteristic impedance as functions of the frequency and different dimensions and conductivity of the substrate, are obtained in 3D.