Dimensionality reduction for the on-chip integration of advanced photonic devices and functionalities

D. Melati, M. K. Dezfouli, Y. Grinberg, Muhammad Al-Digeil, Danxia Xu, J. Schmid, P. Cheben, A. Waqas, P. Manfredi, Jianhao Zhang, L. Vivien, C. Alonso‐Ramos
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Abstract

Design of modern photonic devices requires to handle a large number of parameters and figures of merit. By scaling down the complexity of the problem, machine learning dimensionality reduction enables the discovery of better performing devices, higher integration scale, and efficient evaluation of fabrication tolerances.
先进光子器件和功能片上集成的降维
现代光子器件的设计需要处理大量的参数和数值。通过降低问题的复杂性,机器学习降维可以发现性能更好的设备,更高的集成规模,以及对制造公差的有效评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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