Coplanar transmission lines on silicon substrates for the mm-wave applications

A. Hamidian, V. Subramanian, R. Shu, A. Malignaggi, G. Boeck
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引用次数: 11

Abstract

This work investigates the design of two different coplanar transmission lines and their application at millimeter wave frequencies up to 100 GHz. The coplanar structure has been selected to improve the grounding and also to remove the effect of the fillers on the transmission line. The two transmission lines differ by their bottom metal layer pattern. In the first transmission line the bottom metal is solid ground while in the second transmission line the bottom metal layer is used as a shield. The transmission lines are optimized for different parameters like insertion loss, inductance per unit length and size. Also to justify the electromagnetic simulated models of the transmission lines, different transmission lines have been realized and measured. The characteristics of the transmission lines are extracted from the measurement results. Comparison of the model and the measured results shows a good agreement up to 100 GHz. Finally, two 60 GHz amplifiers in 90 nm CMOS technology were designed based on these transmission lines.
毫米波应用的硅衬底共面传输线
本文研究了两种不同的共面传输线的设计及其在100ghz毫米波频率下的应用。选择共面结构是为了改善接地效果,同时也消除了填料对传输线的影响。这两条传输线的底部金属层图案不同。在第一传输线中,底部金属是实心接地,而在第二传输线中,底部金属层用作屏蔽层。根据插入损耗、单位长度电感和尺寸等参数对传输线进行了优化。为了验证传输线的电磁仿真模型,对不同的传输线进行了实现和测量。从测量结果中提取传输线的特性。模型与实测结果的比较表明,在100ghz范围内,模型与实测结果吻合良好。最后,基于这些传输线设计了两个采用90 nm CMOS技术的60 GHz放大器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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