The GAAFETs with Five Stacked Ge Nano-sheets Made by 2D Ge/Si Multilayer Epitaxy, Excellent Selective Etching, and Conformal Monolayer Doping

C. Chu, G. Luo, Kehuey Wu, Shih-Hong Chen, Chieng-Chung Hsu, Bo-Yuan Chen, Kun‐Lin Lin, Wen-Fa Wu, W. Yeh
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Abstract

Horizontally five stacked pure-Ge nanosheets (NSs) GAA FETs are demonstrated. In this device process, we intentionally grow large mismatch Ge/Si multilayers rather than Ge/GeSi multilayers as the starting material, because the large difference of material properties between Ge/Si is beneficial to the selective etching process. In order to avoid island growth, the flat Ge/Si multilayers are grown at a low temperature. Due to the excellent selective etching, the shape of Ge NSs almost keeps unchanged after etching. Additionally we found the dislocations in suspended Ge sheets are more easily to remove than the case that Ge layers are still tied with Si layers. Since the stacked NSs channels is tall and the pitch between channels is short, the conventional wrap-around contact (WAC) is not applicable. Here for the first time we propose the conformal monolayer doping (MLD) method for source/drain doping of tall NSs FETs.
采用二维Ge/Si多层外延、优良的选择性蚀刻和共形单层掺杂制备五层堆叠Ge纳米片gaafet
展示了5个水平堆叠的纯锗纳米片GAA场效应管。在该器件工艺中,我们有意生长大错配的Ge/Si多层而不是Ge/GeSi多层作为起始材料,因为Ge/Si之间材料性质的较大差异有利于选择性蚀刻工艺。为了避免孤岛生长,在低温下生长扁平的Ge/Si多层膜。由于优良的选择性蚀刻,Ge NSs的形状在蚀刻后几乎保持不变。此外,我们发现悬浮Ge片中的位错比仍然与Si层捆绑在一起的情况下更容易消除。由于堆叠的NSs通道很高,通道之间的间距很短,因此传统的绕接接触(WAC)不适用。本文首次提出了用于高NSs场效应管源极/漏极掺杂的适形单层掺杂(MLD)方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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