K. Higashi, A. Adan, M. Fukumi, N. Tanba, T. Yoshimasu, M. Hayashi
{"title":"ESD protection of RF circuits in standard CMOS process","authors":"K. Higashi, A. Adan, M. Fukumi, N. Tanba, T. Yoshimasu, M. Hayashi","doi":"10.1109/MWSYM.2002.1011551","DOIUrl":null,"url":null,"abstract":"The tradeoffs in the ESD protection device for RFCMOS circuits are described, and the characteristics of an SCR-based ESD structure are presented. The parasitic capacitance of the ESD structure is reduced to /spl sim/150 fF. 3 kV HBM and 750 V CDM are achieved in a LNA working at 2.5 GHz with NF<4dB, applicable for Bluetooth wireless transceiver.","PeriodicalId":299621,"journal":{"name":"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2002.1011551","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
The tradeoffs in the ESD protection device for RFCMOS circuits are described, and the characteristics of an SCR-based ESD structure are presented. The parasitic capacitance of the ESD structure is reduced to /spl sim/150 fF. 3 kV HBM and 750 V CDM are achieved in a LNA working at 2.5 GHz with NF<4dB, applicable for Bluetooth wireless transceiver.