Further studies of different contact aid compounds for aluminum-to-copper connections

Abstract

The effect of contact-aid compounds on the stability of aluminum-to-copper connections under different operating and field conditions has been investigated. A number of contact-aid compounds, previously not evaluated, were subjected to parametric, stability and field tests. The contact aids were evaluated and ranked on the basis of their stability to a thermal degradation, spreading tendency, stability to UV radiation and field conditions as well their effect on their effects on the performance of aluminum-to-copper contacts under current-cycling and fretting.