GE high density interconnect: a solution to the system interconnect problem

Abstract

It is noted that the General Electric high density interconnect (GE-HDI) is an excellent solution to the digital multichip packaging problem, and it offers solutions to other difficult system interconnect problems in analog power, microwave, display, and sensors. GE-HDI offers the closest hybrid solution to wafer scale integration, achieving the benefits of performance and density without the limitations and yield problems of the monolithic approach. Relative to other hybrid applications, it offers significant advantages in performance and anticipated reliability due to its sputtered metal interconnection and excellent thermal properties while not sacrificing density or cost. Maskless adaptive lithography allows for rapid prototyping and flexibility in design and debugging. With the complete absence of tooling for mask or tape bonding, NRE costs are the lowest of any multichip module technology. HDI also requires the fewest processing steps, because there is no need to mount die on tape or to do lead or die bumping.<>