Thermo-mechanical simulation of die-level packaged 3-axis MEMS gyroscope performance

Abstract

In this paper we present accurate thermo-mechanical simulations of a MEMS gyroscope sensor, with its die-level package. The models, simulation tools, methodology and results are presented. The resonance frequency shifts of the modes of interest (drive and 3 sense modes) and the shift in sense capacitances are simulated and compared to experimental results. Simulations compare well with the results.