Enabling technologies for multi-chip integration using Proximity Communication

Abstract

Proximity Communication enables high-performance multi-chip packages by providing high-bandwidth, low-power, and low-latency chip-to-chip I/O. Chips are placed face-to-face, with only a few microns of separation, such that overlapping transceiver circuits can send and receive signals through capacitive or inductive coupling. Packaging chips in this way, however, presents a number of physical challenges. The multi-chip package must hold and maintain the chips in precise alignment. This paper presents a number of electrical and mechanical technologies that address these challenges to enable multi-chip integration using Proximity Communication.