Temperature dependency of MOSFET device characteristics in 4H- and 6H-silicon carbide (SiC)

Abstract

An analytical model for lateral MOSFET that includes the effects of temperature variation in 4H- and 6H-SiC poly-type is presented in this paper. The model includes the effect of temperature variation on the threshold voltage, the carrier mobility, the body leakage current, and the drain and source contact region resistances. MOSFET device behavior in 4H-SiC is also simulated and compared with 6H-SiC material system.