Susceptibility of Microweids in Hybrid Microcincuits to Corrosion Degradation

J. Jellison
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引用次数: 3

Abstract

Analysis of broken ultrasonic Al-Ag bonds involving SEM electron microprobe, ion microprobe, and Auger electron spectroscopy indicated that failure was due to corrosion. Subsequent environmental tests demonstrated that Al-Ag bonds are highly susceptible to corrosion, but Al-Au and Au-Al bonds are less so. No evidence of corrosion of Au-Ag bonds was found.
杂化微电路中微weids对腐蚀降解的敏感性
利用SEM电子探针、离子探针和俄歇电子能谱对超声Al-Ag键断裂进行分析,发现断裂是由于腐蚀造成的。随后的环境测试表明,Al-Ag键极易受到腐蚀,而Al-Au和Au-Al键则不那么容易受到腐蚀。没有发现Au-Ag键腐蚀的证据。
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