{"title":"A Ka-Band Front-End in 100nm GaAs Process for In-Band Full Duplex Communications","authors":"Talat Cetin, C. Onol, G. Selcuk","doi":"10.1109/EUROCON.2019.8861560","DOIUrl":null,"url":null,"abstract":"In this study the authors introduce a Ka-band front-end to be used for in-band full-duplex (IBFD) communications. The design consists of a Rat-Race coupler to provide self-interference cancellation (SIC), a low noise amplifier (LNA), a power amplifier (PA) and an electrical balancing impedance; all implemented in 100nm low noise GaAs process provided by UMS. The circuit provided an isolation above 40 dB between the PA and the LNA. The 1 dB compression point of the transmitter at the antenna terminal is 12 dBm and the total noise Figure (NF) is better than 5 dB. The balancing impedance covers 3:1 voltage standing wave ratio (VSWR) circle in Smith chart. The chip consumes 500 mW power and has a die area of 7mm2.","PeriodicalId":232097,"journal":{"name":"IEEE EUROCON 2019 -18th International Conference on Smart Technologies","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE EUROCON 2019 -18th International Conference on Smart Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROCON.2019.8861560","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this study the authors introduce a Ka-band front-end to be used for in-band full-duplex (IBFD) communications. The design consists of a Rat-Race coupler to provide self-interference cancellation (SIC), a low noise amplifier (LNA), a power amplifier (PA) and an electrical balancing impedance; all implemented in 100nm low noise GaAs process provided by UMS. The circuit provided an isolation above 40 dB between the PA and the LNA. The 1 dB compression point of the transmitter at the antenna terminal is 12 dBm and the total noise Figure (NF) is better than 5 dB. The balancing impedance covers 3:1 voltage standing wave ratio (VSWR) circle in Smith chart. The chip consumes 500 mW power and has a die area of 7mm2.