GENERALISATION AND EVALUATION OF MACROSCOPIC MODELS FOR MICROWAVE SUSCEPTORS IN CONTACT WITH HEATED FOODS

M. Celuch, K. Wilczyński, M. Olszewska-Placha
{"title":"GENERALISATION AND EVALUATION OF MACROSCOPIC MODELS FOR MICROWAVE SUSCEPTORS IN CONTACT WITH HEATED FOODS","authors":"M. Celuch, K. Wilczyński, M. Olszewska-Placha","doi":"10.4995/ampere2019.2019.9847","DOIUrl":null,"url":null,"abstract":"Introducing a thin conductive layer into a finite-mesh (as inherent in e.g. finite difference time domain (FDTD) and finite element (FEM) methods) typically requires a dedicated equivalent macroscopic model allowing for computationally effective and accurate electromagnetic (EM) and thermal simulations. Thin conductive layers, such as microwave susceptors, characterised by their surface resistance (Rs), are adequately represented with a dielectric surrogate layer of higher thickness and proportionally scaled conductivity, maintaining the value of Rs. Systematic evaluation of macroscopic models of microwave susceptors used for enhancing the heating efficiency of microwavable food packages has been reported in [1]. Our studies therein focus on validity, accuracy and practical application limits of the proposed macroscopic models of thin metallic layers, in terms of power dissipated in susceptor placed in free space and irradiated by EM wave, at all angles of incidence. In this work we extend our studies to real-life simulation scenarios, in which microwave susceptor is in contact with food. We first consider a four-layer model as in Fig. 1(left) and conduct both analytical and numerical conformal FDTD calculations. The accuracy and application limit of the macroscopic model are investigated for all incidence angles and both, TE and TM polarisations of the impinging EM wave, for different foods. We aim to determine a range of optimum, in terms of power dissipated in the susceptor, values of the susceptor’s surface resistance in all those cases. The results of our canonical calculations with the four-layer model of Fig.1(left) are validated in the 3D FDTD modelling scenario of Fig.1(right), representative of a real-life domestic oven. While for normal incidence our results are in overall agreement with some of the previously published observations [2], they are formalised and generalised to constitute reliable guidelines for microwave oven and food packaging designers and manufacturers. We also show cases where some of the earlier rule-of-the-thumb guidelines fail.","PeriodicalId":277158,"journal":{"name":"Proceedings 17th International Conference on Microwave and High Frequency Heating","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 17th International Conference on Microwave and High Frequency Heating","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4995/ampere2019.2019.9847","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Introducing a thin conductive layer into a finite-mesh (as inherent in e.g. finite difference time domain (FDTD) and finite element (FEM) methods) typically requires a dedicated equivalent macroscopic model allowing for computationally effective and accurate electromagnetic (EM) and thermal simulations. Thin conductive layers, such as microwave susceptors, characterised by their surface resistance (Rs), are adequately represented with a dielectric surrogate layer of higher thickness and proportionally scaled conductivity, maintaining the value of Rs. Systematic evaluation of macroscopic models of microwave susceptors used for enhancing the heating efficiency of microwavable food packages has been reported in [1]. Our studies therein focus on validity, accuracy and practical application limits of the proposed macroscopic models of thin metallic layers, in terms of power dissipated in susceptor placed in free space and irradiated by EM wave, at all angles of incidence. In this work we extend our studies to real-life simulation scenarios, in which microwave susceptor is in contact with food. We first consider a four-layer model as in Fig. 1(left) and conduct both analytical and numerical conformal FDTD calculations. The accuracy and application limit of the macroscopic model are investigated for all incidence angles and both, TE and TM polarisations of the impinging EM wave, for different foods. We aim to determine a range of optimum, in terms of power dissipated in the susceptor, values of the susceptor’s surface resistance in all those cases. The results of our canonical calculations with the four-layer model of Fig.1(left) are validated in the 3D FDTD modelling scenario of Fig.1(right), representative of a real-life domestic oven. While for normal incidence our results are in overall agreement with some of the previously published observations [2], they are formalised and generalised to constitute reliable guidelines for microwave oven and food packaging designers and manufacturers. We also show cases where some of the earlier rule-of-the-thumb guidelines fail.
与加热食品接触的微波感受器宏观模型的推广和评价
将薄导电层引入有限网格(如固有的有限差分时域(FDTD)和有限元(FEM)方法)通常需要一个专用的等效宏观模型,允许计算有效和准确的电磁(EM)和热模拟。薄导电层,如微波感受器,以其表面电阻(Rs)为特征,用更高厚度和成比例比例的电导率的介电替代层充分表示,保持Rs的值。用于提高微波食品包装加热效率的微波感受器宏观模型的系统评估已在[1]中报道。我们的研究集中在所提出的金属薄层宏观模型的有效性、准确性和实际应用的局限性方面,即在自由空间中电磁波在各个入射角照射下的电纳耗散功率。在这项工作中,我们将我们的研究扩展到现实生活中的模拟场景,其中微波受纳器与食物接触。我们首先考虑如图1(左)所示的四层模型,并进行解析和数值共形时域有限差分计算。对不同食品在所有入射角和入射电磁波的TE偏振和TM偏振下的宏观模型的精度和应用限制进行了研究。我们的目标是确定一个最佳的范围,在所有这些情况下,在电纳的功率耗散,电纳的表面电阻值。我们对图1(左)四层模型的典型计算结果在图1(右)的三维时域有限差分建模场景中得到验证,图1(右)代表了一个实际的家用烤箱。虽然对于正常发生率,我们的结果与先前发表的一些观察结果总体上是一致的,但它们是形式化和一般化的,为微波炉和食品包装设计师和制造商提供了可靠的指导方针。我们还展示了一些早期经验法则指南失败的案例。
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