Performance of Multipactor Coatings Applied Using Atomic Layer Deposition

R. Ives, C. Oldham, M. Gilmore, I. Kern
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Abstract

Multipactor emission can be as serious problem for high power RF devices, particularly RF windows. It can lead to destructive heating of the ceramic or arcing on the window surface. This is typically addressed by sputtering a thin layer of titanium nitride on the vacuum side of the window ceramic. This works well for relatively small ceramics but leads to poor uniformity over large surfaces. High power RF windows are required at 704 MHz, which require windows approximately 23 inches in diameter. This is larger than can be reliably coated using sputtering. This research is developing technology to apply Multipactor suppression coatings using Atomic Layer Deposition (ALD), which provides unprecedented control of the coating thickness and uniformity. It is independent of surface area and allows coating of multiple surfaces in parallel, with associated cost reduction. In addition, ALD bonding is stronger than that provided by sputtering, leading to more robust protection. This presentation will describe the ALD system and process. Test structures were fabricated, and the RF loss and secondary electron yield were measured. The measurement system and results will also be presented.
原子层沉积多因子涂层的性能研究
对于大功率射频器件,特别是射频窗口,多因子发射可能是一个严重的问题。它会导致陶瓷的破坏性加热或窗户表面的电弧。这通常是通过在窗口陶瓷的真空侧溅射一层薄薄的氮化钛来解决的。这对于相对较小的陶瓷来说效果很好,但在大表面上导致均匀性差。704 MHz需要高功率射频窗口,这需要直径约23英寸的窗口。这比使用溅射可以可靠地涂覆的要大。本研究正在开发应用原子层沉积(ALD)的多因子抑制涂层技术,该技术提供了前所未有的涂层厚度和均匀性控制。它与表面积无关,允许多个表面并行涂层,从而降低了相关成本。此外,ALD结合比溅射提供的更强,从而提供更坚固的保护。本报告将介绍ALD的系统和过程。制作了测试结构,测量了射频损耗和二次电子产率。测量系统和结果也将被介绍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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