Optimization of semiconductor ridge waveguide lasers for improved temperature characteristics

Xiang Li, Hong Wang, Z. Qiao, Xin Guo, K. Ang, Chongyang Liu
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Abstract

Summary form only given. Semiconductor ridge waveguide (RWG) laser fabrication process has been optimized. RWG lasers with different ridge height of 0.39 μm, 0.80 μm, 1.23 μm, 1.55 μm and 1.77 μm were fabricated. All the RWG lasers have the same contact ridge width of 50 μm and cavity length of 1100 μm. The dependence of the ridge height on the temperature performance of these lasers has been systematically investigated. It was found that the optimum ridge height is 1.23 μm, corresponding to an etching depth where all the p-doped layers above the active region were removed. The RWG laser with this ridge height worked up to 100 °C successfully, and also showed the highest characteristic temperature (T0) among all the five group lasers. The T0 became worse when the ridge height extends below the active region. Our study suggests the significance of the optimization of the ridge waveguide to the laser diode performance.
半导体脊波导激光器的温度特性优化
只提供摘要形式。对半导体脊波导(RWG)激光器的制造工艺进行了优化。制备了脊高分别为0.39 μm、0.80 μm、1.23 μm、1.55 μm和1.77 μm的RWG激光器。所有RWG激光器的接触脊宽均为50 μm,腔长均为1100 μm。系统地研究了脊高对这些激光器温度性能的依赖关系。结果表明,最优脊高为1.23 μm,对应于去除活性区以上所有p掺杂层的刻蚀深度。该脊高的RWG激光器工作温度高达100°C,并且在五组激光器中显示出最高的特征温度(T0)。当脊高延伸至活动区下方时,T0变差。我们的研究表明了脊波导的优化对激光二极管性能的重要意义。
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