Future Opportunities in Diplexer Design

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Abstract

This chapter focuses on the future and present state of art relating to microwave diplexer design. It particularly highlights the future opportunities in making improvements in the diplexer design process in order to achieve better miniaturised diplexer components. The ideas discussed in this chapter could be futher investigated by researchers, including postgraduate students pursuing Master of Science (i.e., M.Sc.) and/or Doctor of Philosophy (i.e., Ph.D.) degrees. The chapter briefly discussed some varients of the SIW transmission line technology including the half-mode substrate integrated waveguide (HMSIW) and the folded substrate integrated waveguide (FSIW).
双工器设计的未来机遇
本章重点介绍微波双工器设计的未来和现状。它特别强调了改进双工器设计过程的未来机会,以实现更好的小型化双工器组件。本章讨论的观点可以被研究人员进一步研究,包括攻读理学硕士(即,M.Sc.)和/或哲学博士(即,Ph.D.)学位的研究生。本章简要讨论了SIW传输线技术的几种变体,包括半模衬底集成波导(HMSIW)和折叠衬底集成波导(FSIW)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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