3D topography of the micro cracks of subsurface damages by etching process

Hairong Wang, Cheng Guan, Bike Zhang, Guoying Yuan
{"title":"3D topography of the micro cracks of subsurface damages by etching process","authors":"Hairong Wang, Cheng Guan, Bike Zhang, Guoying Yuan","doi":"10.1109/3M-NANO.2012.6472957","DOIUrl":null,"url":null,"abstract":"The existence of the subsurface damage of high-precision components is becoming a bottleneck for better performance of high-precision components in the fields of energy, space, national defense equipment, integrated circuit, MEMS and so on. So far there is still no method which is capable of characterizing the 3D topography of subsurface fractures, and this paper presents an idea of investigating the full information of the subsurface damages based on the etching experiments. By micro-indentations some individual subsurface damages with specific geometrical cracks were artificially prepared first, and then dealt with the conventional etching process. The etching process was carried out in the differential mode, namely etching with certain interval time. All 3D topographies of etched cracks during etching were recorded and, dimensions of initial fractures including length, width, depth, etc. were calculated according to the 3D data. Comparison of the calculated results and designed geometrical features indicated that the method used in the paper is a valid method to roughly characterize 3D information of the fractures of the subsurface damage layer and in discussion we proposed a numerical model to accurately characterize the initial 3D holographic information of fractures.","PeriodicalId":134364,"journal":{"name":"2012 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3M-NANO.2012.6472957","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The existence of the subsurface damage of high-precision components is becoming a bottleneck for better performance of high-precision components in the fields of energy, space, national defense equipment, integrated circuit, MEMS and so on. So far there is still no method which is capable of characterizing the 3D topography of subsurface fractures, and this paper presents an idea of investigating the full information of the subsurface damages based on the etching experiments. By micro-indentations some individual subsurface damages with specific geometrical cracks were artificially prepared first, and then dealt with the conventional etching process. The etching process was carried out in the differential mode, namely etching with certain interval time. All 3D topographies of etched cracks during etching were recorded and, dimensions of initial fractures including length, width, depth, etc. were calculated according to the 3D data. Comparison of the calculated results and designed geometrical features indicated that the method used in the paper is a valid method to roughly characterize 3D information of the fractures of the subsurface damage layer and in discussion we proposed a numerical model to accurately characterize the initial 3D holographic information of fractures.
蚀刻过程中亚表面损伤微裂纹的三维形貌
高精度元件亚表面损伤的存在,正成为能源、航天、国防装备、集成电路、微机电系统等领域提高高精度元件性能的瓶颈。目前还没有能够表征地下裂缝三维形貌的方法,本文提出了一种基于刻蚀实验研究地下损伤全信息的思路。首先通过微压痕人工制备具有特定几何裂纹的单个亚表面损伤,然后进行常规刻蚀处理。蚀刻过程采用差分模式,即以一定的间隔时间进行蚀刻。记录蚀刻过程中蚀刻裂纹的所有三维形貌,并根据三维数据计算初始裂纹的尺寸,包括长度、宽度、深度等。计算结果与设计几何特征的对比表明,本文所采用的方法是粗略表征亚表面损伤层裂缝三维信息的有效方法,并在讨论中提出了一种能够准确表征亚表面损伤层裂缝初始三维全息信息的数值模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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