H.-M. Wu, J. Lin, L. Peng, C. Lee, J. Chyi, E. Chen
{"title":"Annealing effects on the interfacial properties of GaN MOS prepared by photo-enhanced wet oxidation","authors":"H.-M. Wu, J. Lin, L. Peng, C. Lee, J. Chyi, E. Chen","doi":"10.1109/ISDRS.2003.1272156","DOIUrl":null,"url":null,"abstract":"The authors investigate the annealing effects on the interfacial properties of gallium oxide (Ga/sub 2/O/sub 3/) grown on gallium nitride (GaN) by the photo-enhanced wet oxidation technique. The depth profile resolved XPS analysis indicates an interfacial layer as thin as 20nm can be maintained at the Ga/sub 2/O/sub 3//GaN interface when subject to a rapid thermal annealing in an oxygen ambient at 800/spl deg/C. The authors I-V and C-V analysis on the MOS device reveals a low interfacial density of state /spl sim/5/spl times/10/sup 10/ cm/sup -2/eV/sup -1/ and high breakdown field above 3MV/cm. These results suggest the photo-grown Ga/sub 2/O/sub 3/ with post O/sub 2/ annealing is suitable for power device application.","PeriodicalId":369241,"journal":{"name":"International Semiconductor Device Research Symposium, 2003","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Semiconductor Device Research Symposium, 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISDRS.2003.1272156","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The authors investigate the annealing effects on the interfacial properties of gallium oxide (Ga/sub 2/O/sub 3/) grown on gallium nitride (GaN) by the photo-enhanced wet oxidation technique. The depth profile resolved XPS analysis indicates an interfacial layer as thin as 20nm can be maintained at the Ga/sub 2/O/sub 3//GaN interface when subject to a rapid thermal annealing in an oxygen ambient at 800/spl deg/C. The authors I-V and C-V analysis on the MOS device reveals a low interfacial density of state /spl sim/5/spl times/10/sup 10/ cm/sup -2/eV/sup -1/ and high breakdown field above 3MV/cm. These results suggest the photo-grown Ga/sub 2/O/sub 3/ with post O/sub 2/ annealing is suitable for power device application.