Annealing effects on the interfacial properties of GaN MOS prepared by photo-enhanced wet oxidation

H.-M. Wu, J. Lin, L. Peng, C. Lee, J. Chyi, E. Chen
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引用次数: 3

Abstract

The authors investigate the annealing effects on the interfacial properties of gallium oxide (Ga/sub 2/O/sub 3/) grown on gallium nitride (GaN) by the photo-enhanced wet oxidation technique. The depth profile resolved XPS analysis indicates an interfacial layer as thin as 20nm can be maintained at the Ga/sub 2/O/sub 3//GaN interface when subject to a rapid thermal annealing in an oxygen ambient at 800/spl deg/C. The authors I-V and C-V analysis on the MOS device reveals a low interfacial density of state /spl sim/5/spl times/10/sup 10/ cm/sup -2/eV/sup -1/ and high breakdown field above 3MV/cm. These results suggest the photo-grown Ga/sub 2/O/sub 3/ with post O/sub 2/ annealing is suitable for power device application.
退火对光增强湿氧化制备GaN - MOS界面性能的影响
研究了光增强湿式氧化技术对氮化镓(GaN)表面生长的氧化镓(Ga/sub 2/O/sub 3/)界面性能的退火影响。深度剖面解析XPS分析表明,在800℃的氧气环境中快速退火后,在Ga/sub 2/O/sub 3/ GaN界面处可保持薄至20nm的界面层。对该MOS器件进行I-V和C-V分析,发现其界面密度为/spl / sim/5/spl次/10/sup 10/ cm/sup -2/eV/sup -1/,击穿场在3MV/cm以上。这些结果表明光生长的Ga/sub 2/O/sub 3/与后O/sub 2/退火是适合于功率器件应用的。
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