Backside EBIRCH Defect Localization for Advanced Flip-Chip Failure Analysis

Abstract

This paper introduced a novel defect localization approach by performing EBIRCH isolation from backside of flip-chips. Sample preparation and probing consideration was discussed, and then a case study was used to illustrate how the backside EBIRCH technique provides a powerful solution in capturing and root-causing subtle defects in challenging flip-chip failures.