Energy Efficient ADC for Low Fan-Out MIMO Sub- THz Imaging System in SiGe: BiCMOS Technology

Max Uhlmann, R. Hussung, M. Eissa, A. Keil, F. Friederich, G. Fischer, P. Ostrovskyy
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引用次数: 1

Abstract

This paper presents a top-down architectural analysis of a MIMO imaging system in terms of analog-to-digital converter (ADC) requirements. This helps to determine the optimal ADC accuracy and make the right choice for an ADC circuit architecture, without going into an over design effort. It results in a 32 MS/s 8-bit SAR ADC based on a hybrid DAC architecture. The ADC was designed in a 130nm SiGe BiCMOS process, demonstrating core power consumption of 0.3mW from a 1.2V supply. The ADC core occupies a 0.23×0.13mm2 silicon area and can be easily integrated with a 220–260 GHz imaging receiver on the same IC. It will significantly improve power consumption, form factor and assembly of the complete MIMO imaging system.
低扇出MIMO亚太赫兹成像系统的高能效ADC: BiCMOS技术
本文从模数转换器(ADC)的要求出发,对MIMO成像系统进行了自上而下的架构分析。这有助于确定最佳ADC精度,并为ADC电路架构做出正确的选择,而无需过度设计。基于混合DAC架构的32 MS/s 8位SAR ADC。该ADC采用130nm SiGe BiCMOS工艺设计,在1.2V电源下的核心功耗为0.3mW。ADC核心占用0.23×0.13mm2硅面积,可以轻松地与同一IC上的220-260 GHz成像接收器集成。它将显着改善整个MIMO成像系统的功耗,外形尺寸和组装。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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