Uncooled infrared detector with 12μm pixel pitch video graphics array

T. Endoh, S. Tohyama, T. Yamazaki, Yutaka Tanaka, K. Okuyama, Seiji Kurashina, Masaru Miyoshi, Kouji Katoh, Takashi Yamamoto, Y. Okuda, Tokuhito Sasaki, Haruo Ishizaki, T. Nakajima, K. Shinoda, T. Tsuchiya
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引用次数: 17

Abstract

Uncooled infrared detectors with 12μm pixel pitch video graphics array (VGA) have been developed. To improve the signal to noise ratio (SNR) for 12μm pixel pitch, a highly sensitive bolometer material, an advanced pixel structure for thermal isolation and a newly designed read-out IC (ROIC) have been also developed. The bolometer material has been improved by using vanadium niobate. Over a wide range of temperature, temperature coefficient of resistance (TCR) is achieved higher level than -3.6%/K, which is 2 times higher than that for the conventional bolometer material. For thermal isolation, thermal conductance (Gth) value for the new pixel structure, fabricated by using triple level sacrificial layer process, is estimated to be 5nW/K, which is 1/5 times lower than that for the conventional pixel structure. On the other hand, since the imaging area is reduced by the pixel pitch, the uniformity of pixel can be improved. This enables to remove the non-uniformity correction (NUC) circuit in the ROIC. Removal of this circuit is effective for low power and low noise. This 12μm pixel pitch VGA detector is packaged in a compact (24 × 24 × 6.5 mm) and lightweight (11g) ceramic package. In addition, it has been incorporated in a newly developed prototype miniature imager. The miniature imager has dimension of 25(H) ×25(W) ×28(L) mm and weight of 30g. This imager is compact and small enough to fit in your hand. Hereafter, this imager is greatly expected to be applied to mobile systems.
带有12μm像素间距视频图形阵列的非冷却红外探测器
研制了12μm节距视频图形阵列(VGA)非冷却红外探测器。为了提高12μm像素间距的信噪比(SNR),研究人员还开发了一种高灵敏度的测热材料、一种先进的热隔离像素结构和一种新设计的读出IC (ROIC)。利用铌酸钒对测热材料进行了改进。在较宽的温度范围内,电阻温度系数(TCR)达到高于-3.6%/K的水平,是传统测热计材料的2倍。在热隔离方面,采用三能级牺牲层工艺制备的新像元结构的导热系数(Gth)估计为5nW/K,比传统像元结构的导热系数低1/5。另一方面,由于像素间距减小了成像面积,因此可以提高像素的均匀性。这样可以消除ROIC中的非均匀性校正(NUC)电路。去除该电路是有效的低功耗和低噪声。这款12μm像素间距的VGA检测器封装在紧凑(24 × 24 × 6.5 mm)和轻质(11g)陶瓷封装中。此外,它已被纳入一个新开发的原型微型成像仪。该微型成像仪尺寸为25(H) ×25(W) ×28(L) mm,重量为30g。这个成像仪小巧玲珑,可以放在手里。今后,该成像仪有望应用于移动系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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