Analysis of Power Distribution Network in glass, silicon interposer and PCB

Abstract

3D integration using a glass interposer and through glass via technologies is expected to improve the performance of a whole system significantly. However, due to the high quality factor of the glass substrate, the sharp impedance peaks on the Power Distribution Networks arise at the resonances. When the mode resonances occur, performance of a whole system could be degraded. Segmentation based impedance-estimation was used to analyze the PDN impedance and analyzed system degradation at resonance frequencies. To maximize advantages of the glass interposers, the PDN should be carefully designed to suppress the resonances. Considering the current status of the glass fabrication processes, we propose that placing the ground vias near the signal vias is the most promising solution for maximizing the advantages of the glass interposers.