{"title":"Metal Insulator Metal Capacitors, Spiral Inductors and Resistors for Multilayer CPW MMIC","authors":"E. Sinulingga, Abdul Risyal Nasution","doi":"10.1109/ELTICOM57747.2022.10038169","DOIUrl":null,"url":null,"abstract":"Lumped elements such as inductors and capacitors often occupy the most area on the MMIC chip. The multilayer technique was presented as an alternative to reduce the area of those elements. Furthermore, variation of lumped elements is still limited for multilayer CPW MMIC applications. Therefore, in this research, several variations of multilayer capacitors, inductors, and resistors for MMIC application were presented. The folded design of the capacitor and overlap design of the inductor was utilized to obtain higher capacitance and inductance, respectively. The NiCr resistor with various sizes was also designed to obtain various resistance values. The characteristic of the capacitor, inductor, and resistor was analyzed using scattering parameters and validated using measured data. The MIM capacitor with capacitances of 0.4 to 2.4 pF has been realized, spiral inductors with inductances of 0.6 to 7.6 nH, and NiCr thin film resistors with resistances of 20 $\\Omega$ to 150 $\\Omega$ were also presented in this paper.","PeriodicalId":406626,"journal":{"name":"2022 6th International Conference on Electrical, Telecommunication and Computer Engineering (ELTICOM)","volume":"201 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 6th International Conference on Electrical, Telecommunication and Computer Engineering (ELTICOM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELTICOM57747.2022.10038169","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Lumped elements such as inductors and capacitors often occupy the most area on the MMIC chip. The multilayer technique was presented as an alternative to reduce the area of those elements. Furthermore, variation of lumped elements is still limited for multilayer CPW MMIC applications. Therefore, in this research, several variations of multilayer capacitors, inductors, and resistors for MMIC application were presented. The folded design of the capacitor and overlap design of the inductor was utilized to obtain higher capacitance and inductance, respectively. The NiCr resistor with various sizes was also designed to obtain various resistance values. The characteristic of the capacitor, inductor, and resistor was analyzed using scattering parameters and validated using measured data. The MIM capacitor with capacitances of 0.4 to 2.4 pF has been realized, spiral inductors with inductances of 0.6 to 7.6 nH, and NiCr thin film resistors with resistances of 20 $\Omega$ to 150 $\Omega$ were also presented in this paper.