Challenges for analog circuits in sub-100 nm CMOS nodes

Bernd Landgraf
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引用次数: 1

Abstract

New challenges are arising with the entrance in sub-100 nm CMOS nodes. Dominant sources of the MOSFET leakage which differ from those of previous nodes are examined. Consequences for the analog circuit design due to smaller dimensions and an accompanying higher variance of important analog parameters like threshold voltage in combination with shrinking VDD headroom are highlighted. As an example, the matching behavior of long channel and short channel halo-doped MOSFETS is examined. Furthermore, the disadvantages of the BEOL (Back End Of Line) due to the smaller dimensions are analyzed. Especially the reliability requirements of these BEOL design rules are discussed. Consequences on the layout are demonstrated by applying an EM & IR drop tool.
亚100nm CMOS节点模拟电路的挑战
随着sub- 100nm CMOS节点的进入,出现了新的挑战。研究了不同于以往节点的MOSFET泄漏的主要来源。由于更小的尺寸和随之而来的重要模拟参数(如阈值电压)的更高方差以及VDD净空的缩小,对模拟电路设计的影响得到了强调。作为一个例子,研究了长通道和短通道掺杂的mosfet的匹配行为。此外,还分析了BEOL(后端线)由于尺寸较小而存在的缺点。重点讨论了这些BEOL设计规则的可靠性要求。通过应用EM & IR拖放工具演示了对布局的影响。
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