Design considerations for surface mountable DC-DC converters

APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285) Pub Date : 1999-03-14 DOI:10.1109/APEC.1999.749668

S. O’Driscoll, B. McDermott

引用次数: 2

Abstract

The key contender packaging systems for high specification surface mountable (SMT) DC-DC power converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. Thermal performance comparison data are presented. Mechanical performance criteria, evaluating the power converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.

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表面贴装DC-DC转换器的设计注意事项

综述了高规格表面贴装(SMT) DC-DC电源转换器的主要竞争者封装系统。检查各种衬底，引线和封装选项的可靠性和真正的表面贴装性。研究了开框设计和模制设计。给出了热工性能对比数据。机械性能标准，评估功率转换器作为SMT组件概述。讨论了制造和最终用户过程问题。概述了电气设计注意事项。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)

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