Techniques and thermoplastics for encapsulating high performance coils

Proceedings of Electrical/Electronics Insulation Conference Pub Date : 1993-10-04 DOI:10.1109/EEIC.1993.630950

James F. B. Patterson, J. Lang, M. Hozumi

引用次数: 0

Abstract

Recent developments in thermoplastic encapsulation materials, molding techniques, and mold design for encapsulating high performance coils are reviewed. Recently developed encapsulation systems for UL 1446 Class F (155 C) and Class H (180 C) applications are discussed.

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封装高性能线圈的技术和热塑性塑料

综述了高性能线圈封装用热塑性封装材料、成型技术和模具设计的最新进展。讨论了最近开发的UL 1446 F级(155 C)和H级(180 C)应用的封装系统。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of Electrical/Electronics Insulation Conference

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