Efficient cell electrofusion chip based on micromanipulation

Abstract

A novel cell electrofusion chip based on the micromanipulation technique was presented. A fast, accurate and flexible cell pairing method was developed for this chip. The chip prototype was fabricated on a indium tin oxide (ITO) substrate that was subsequently covered by a positive photoresist film (∼2 μm thickness). Micropore electrodes measuring 25μm in diameter were fabricated on the film by lithography. Electrode arrays with different spacing were manufactured and paired with tungsten needle for cell electrofusion experiment. Result showed that electrodes with a 10mm spacing can pair the cell efficiently, however electrodes with 0.5mm spacing could not attach the cells.