{"title":"Pushing the boundaries of Moore's Law to transition from FPGA to All Programmable Platform","authors":"I. Bolsens","doi":"10.1145/3036669.3041226","DOIUrl":null,"url":null,"abstract":"Since their inception, FPGAs have changed significantly in their capacity and architecture. The devices we use today are called upon to solve problems in mixed-signal, high-speed communications, signal processing and compute acceleration that early devices could not address. The architecture has evolved towards an \"All Programmable\" platform that immerses multiple programmable technologies into a complex interconnect infrastructure that, today, spans the boundary of multiple dies in one package. As the devices continue to grow in capability and complexity, new design tools and methodologies are being proposed. We will discuss future technology challenges that need to be solved in order to continue pushing the boundary of integration.","PeriodicalId":269197,"journal":{"name":"Proceedings of the 2017 ACM on International Symposium on Physical Design","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2017-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2017 ACM on International Symposium on Physical Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3036669.3041226","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Since their inception, FPGAs have changed significantly in their capacity and architecture. The devices we use today are called upon to solve problems in mixed-signal, high-speed communications, signal processing and compute acceleration that early devices could not address. The architecture has evolved towards an "All Programmable" platform that immerses multiple programmable technologies into a complex interconnect infrastructure that, today, spans the boundary of multiple dies in one package. As the devices continue to grow in capability and complexity, new design tools and methodologies are being proposed. We will discuss future technology challenges that need to be solved in order to continue pushing the boundary of integration.