Nicholas Erickson, J. Fan, Xu Gao, B. Achkir, Siming Pan
{"title":"De-embedding techniques for transmission lines: An application to measurements of on-chip coplanar traces","authors":"Nicholas Erickson, J. Fan, Xu Gao, B. Achkir, Siming Pan","doi":"10.1109/ISEMC.2014.6899052","DOIUrl":null,"url":null,"abstract":"In this paper, the de-embedding study presented in the work of Erickson et al. (2013) is extended from the simulation environment to the measurement environment; the three presented de-embedding methods are applied to measurements of on-chip coplanar traces for two different test ICs. Additionally, the Hybrid technique presented in work of Erickson et al. is reformulated so that only two measurement standards are required, as opposed to three. The results of de-embedding the measurement data are discussed, as well as challenges with making the measurements.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2014.6899052","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In this paper, the de-embedding study presented in the work of Erickson et al. (2013) is extended from the simulation environment to the measurement environment; the three presented de-embedding methods are applied to measurements of on-chip coplanar traces for two different test ICs. Additionally, the Hybrid technique presented in work of Erickson et al. is reformulated so that only two measurement standards are required, as opposed to three. The results of de-embedding the measurement data are discussed, as well as challenges with making the measurements.
本文将Erickson et al.(2013)的工作中提出的去嵌入研究从仿真环境扩展到测量环境;将这三种去嵌入方法应用于两种不同测试集成电路的片上共面走线的测量。此外,Erickson等人的工作中提出的混合技术被重新表述,因此只需要两个测量标准,而不是三个。讨论了测量数据去嵌入的结果,以及进行测量时面临的挑战。