The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies

Abstract

In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are used in high-frequency circuits, was calculated by considering height, angle, and length. After these calculations, 3D models and electromagnetic simulations of these interconnections were realized with a computer-aided design tool. Then, bondwires which have different characteristics, are implemented on alumina transmission lines. Furthermore, S-parameters were measured with a 2-port network analyzer using a probe station. Measured insertion loss and reflection values were compared with 3D electromagnetic simulation results, in order to obtain conceivable interconnection.