No clean mass reflow of large over molded plastic pad array carriers (OMPAC)

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398221

J. Lau, J. Miremadi, J. Gleason, R. Haven, S. Ottoboni, S. Mimura

引用次数: 6

Abstract

A no clean mass reflow process for 396-pin, 324-pin, and 225-pin over molded plastic pad array carriers (OMPAC) is presented. Emphasis is placed on the OMPAC assembly parameters, such as the design, material, and process of the packages and printed circuit board (PCB), solder paste, stencil design, printing technology, pick and place, mass reflow, and inspection. Cross sections and the "popcorn" effect of the OMPAC assembly are discussed.<>

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大型模压塑料垫阵载体(OMPAC)没有干净的质量回流

提出了一种用于396针、324针和225针模压塑料衬垫阵列载体(OMPAC)的非清洁质量回流工艺。重点放在OMPAC组装参数上，如封装和印刷电路板(PCB)的设计、材料和工艺、焊膏、模板设计、印刷技术、拾取和放置、大量回流和检查。讨论了OMPAC组件的截面和“爆米花”效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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