Miniaturized Millimeter-wave silicon-based Transceiver System-in-Package for FMCW Radar

Abstract

An immensely miniature, high reliability millimeter-wave (MMW) transceiver System-in-package (SiP) is presented in this paper. A 3-dimensional (3-D) wafer-level package structure is implemented on silicon-substrate which is manufactured by high precision micro-mechanical system (MEMS) fabricating technology. The MMW transceiver SiP consists of a series of microwave/MMW monolithic-integrated circuits (MMICs) like low noise amplifiers, mixers and power amplifiers. The essential passive components, such as filter, power divider, and interconnection structures are integrated in the silicon substrate directly. The good agreements are demonstrated between simulation and measurement results for the integrated microwave/MMW integrated passive components. A high isolation between the RX and TX channels is achieved by the adoption of through-silicon-via (TSV) and metallization silicon cavity. The measured IF output signal-to-noise ratio (SNR) is better than 20 dB in a 30 GHz FMCW radar system. The volume of the SiP is only 25mm×20mm×1mm which exhibits a efficient and feasibly system integration approach.