{"title":"From (integrated) circuits to systems of systems on chip in five decades: How did and will (IC) test technology keep up?","authors":"A. Ivanov","doi":"10.1109/MWSCAS.2007.4488835","DOIUrl":null,"url":null,"abstract":"The past five decades amount to mind boggling progress in IC design and manufacturing technology. In this period, we have gone from the inception of ICs to now what literally amounts to the integration of systems of systems on chip. Whereas experts debate the continued evolution of ICs according to Moore's law beyond the next decade, the advent of the complex integration of multi-physics systems is just in its infancy and is predicted to grow exponentially in the coming years. Designing and manufacturing complex ICs is of course a feat in itself. Testing and testability has often been taken for granted as a necessary (not to say evil) requirement. But who wants of an IC that cannot be duly tested, to ensure quality and reliability, especially when deployed in life-critical applications? Test technology, along with design technology has had to make enormous and rapid progress over the past half-century. Here, we highlight some of the key elements of IC test technology. We briefly mention some directions and challenges and opportunities for test technology in the near future, especially as multi-physics integrated systems of systems continue to emerge and progress on the volume production curves.","PeriodicalId":256061,"journal":{"name":"2007 50th Midwest Symposium on Circuits and Systems","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 50th Midwest Symposium on Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSCAS.2007.4488835","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The past five decades amount to mind boggling progress in IC design and manufacturing technology. In this period, we have gone from the inception of ICs to now what literally amounts to the integration of systems of systems on chip. Whereas experts debate the continued evolution of ICs according to Moore's law beyond the next decade, the advent of the complex integration of multi-physics systems is just in its infancy and is predicted to grow exponentially in the coming years. Designing and manufacturing complex ICs is of course a feat in itself. Testing and testability has often been taken for granted as a necessary (not to say evil) requirement. But who wants of an IC that cannot be duly tested, to ensure quality and reliability, especially when deployed in life-critical applications? Test technology, along with design technology has had to make enormous and rapid progress over the past half-century. Here, we highlight some of the key elements of IC test technology. We briefly mention some directions and challenges and opportunities for test technology in the near future, especially as multi-physics integrated systems of systems continue to emerge and progress on the volume production curves.