From (integrated) circuits to systems of systems on chip in five decades: How did and will (IC) test technology keep up?

A. Ivanov
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引用次数: 3

Abstract

The past five decades amount to mind boggling progress in IC design and manufacturing technology. In this period, we have gone from the inception of ICs to now what literally amounts to the integration of systems of systems on chip. Whereas experts debate the continued evolution of ICs according to Moore's law beyond the next decade, the advent of the complex integration of multi-physics systems is just in its infancy and is predicted to grow exponentially in the coming years. Designing and manufacturing complex ICs is of course a feat in itself. Testing and testability has often been taken for granted as a necessary (not to say evil) requirement. But who wants of an IC that cannot be duly tested, to ensure quality and reliability, especially when deployed in life-critical applications? Test technology, along with design technology has had to make enormous and rapid progress over the past half-century. Here, we highlight some of the key elements of IC test technology. We briefly mention some directions and challenges and opportunities for test technology in the near future, especially as multi-physics integrated systems of systems continue to emerge and progress on the volume production curves.
五十年来从集成电路到片上系统的系统:(IC)测试技术是如何以及将如何跟上?
在过去的50年里,集成电路设计和制造技术取得了令人难以置信的进步。在这一时期,我们已经从ic的初始阶段发展到现在的芯片上系统的集成。尽管专家们对未来十年根据摩尔定律的集成电路的持续发展争论不休,但多物理场系统复杂集成的出现才刚刚起步,预计在未来几年将呈指数级增长。设计和制造复杂的集成电路本身就是一项壮举。测试和可测试性通常被认为是必要的(不是邪恶的)需求。但是,谁想要一个不能经过适当测试的集成电路,以确保质量和可靠性,特别是当部署在生命关键的应用中时?在过去的半个世纪里,测试技术与设计技术一起取得了巨大而迅速的进步。在这里,我们重点介绍了IC测试技术的一些关键要素。我们简要地提到了测试技术在不久的将来的一些方向、挑战和机遇,特别是随着多物理场集成系统的不断出现和在量产曲线上的进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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