A low overhead fault tolerant FPGA with new connection box

F. Wong, Yajun Ha
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引用次数: 3

Abstract

With the increasing process variations in advanced semiconductor technologies, fault tolerance has become one of several essential issues in building Field Programmable Gate Arrays (FPGAs). Unfortunately, there has been much less fault tolerance work previously done on FPGA interconnects, which take up to 90% of an FPGA device, than on its logic blocks. In view of this, we develop a low overhead connection block architecture, which improves the fault tolerance of FPGA interconnects. By testing 10 MCNC benchmarks on the new architecture, FPGA fault tolerance reaches levels comparable to adding 2 extra wire tracks per channel, with the average timing overhead below 2.5% and the area overheads of only 2.5% - 4%.
具有新型连接盒的低开销容错FPGA
随着先进半导体技术中工艺变化的增加,容错已成为构建现场可编程门阵列(fpga)的几个基本问题之一。不幸的是,以前在FPGA互连上所做的容错工作要比在逻辑块上做的容错工作少得多,而FPGA互连要占FPGA器件的90%。鉴于此,我们开发了一种低开销的连接块架构,提高了FPGA互连的容错性。通过在新架构上测试10个MCNC基准,FPGA容错性达到了与每个通道增加2个额外线轨相当的水平,平均时间开销低于2.5%,面积开销仅为2.5% - 4%。
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