Electromechanical characteristics of a bondless pressure contact IGBT

APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285) Pub Date : 1999-03-14 DOI:10.1109/APEC.1999.749659

F. Wakeman, K. Billett, R. Irons, M. Evans

引用次数: 31

Abstract

The mechanical design of a completely bondless, pressure contact IGBT is discussed and its implications on the electrical characteristics are compared to those of a similarly rated module device. It is determined that the differences in the electrical characteristics of a pressure contact IGBT may offer certain advantages in some applications.

查看原文本刊更多论文

无粘结压力触点IGBT的机电特性

讨论了完全无粘结、压力接触IGBT的机械设计，并将其对电气特性的影响与类似额定模块器件的影响进行了比较。可以确定的是，压力触点IGBT的电气特性的差异可能在某些应用中提供某些优势。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)

自引率

0.00%

发文量