Low-power device design of fully-depleted SOI MOSFETs

T. Hiramoto, T. Nagumo, T. Ohtou
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引用次数: 2

Abstract

A new device concept for variable /spl gamma/ FD (Fully-Depleted) SOI MOSFET is proposed by changing substrate depletion layer capacitance. Also a semi-planar 3D-gate SOI MOSFET is proposed, where both sufficient /spl gamma/ and good short effect immunity (SCE) is attained. These two device concepts are proposed for the future VLSI applications. The features of the proposed devices are: utilisation of substrate depletion layer below BOX (buried oxide), three-dimensional gate structure, and low aspect-ratio channel. The problems of standby power consumption, characteristic fluctuations, and performance degradation are solved. Three-dimensional simulation results of these devices are studied.
全耗尽SOI mosfet的低功耗器件设计
通过改变衬底耗尽层电容,提出了可变/spl γ / FD(完全耗尽)SOI MOSFET的新器件概念。此外,还提出了一种半平面3d栅极SOI MOSFET,具有足够的/spl γ /和良好的短效应抗扰度(SCE)。这两个器件概念是为未来的VLSI应用而提出的。所提出器件的特点是:利用BOX(埋藏氧化物)下方的衬底耗尽层,三维栅极结构和低宽高比通道。解决了待机功耗、特性波动、性能下降等问题。对这些装置的三维仿真结果进行了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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